current 40 nm technology platform as well as the already defined 55nm technology platform will be developed and consolidated in order to build a solid manufacturing platform on these technology nodes.

The project will also extend to build the basic blocks of the technology node after 40 nm; with the ambition to achieve a prototyping maturity for a new BEOL based non-volatile memory architecture suitable with the 28 nm node. To achieve this goal of generating high value added semiconductor circuits in Europe in a breakthrough leading edge technology the project will deploy all the necessary activities to bring a new technology to an early industrial maturity stage. These activities encompass such developments as: technology enhancements for various specific application requirements such as wide temperature range and reliability, high security requests, high flexibility, design enablement allowing first time silicon success, prototyping demonstrator products in the different application areas: Automotive, Consumer/Industrial and Secure, insuring reliability of technology and designs.

IMA is being focused on electronic gathering unit prototype design, development and testing. The prototype will integrate new kind of memory samples designed by the pilot-line used to store data from Time-of-Flight camera. Both kinds of memories – eFlash, eNVM are intended to be integrated in board prototype in order to assess the suitability for aimed application. IMA will work on all three tasks, specification, electronics design, integration and evaluation. IMA cooperates with the Czech partner UTIA and partners involved in the area of application platforms, product specification and qualification.